Ericsson, the world’s leading telecom supplier, and Texas Instruments Incorporated (TI), the global leader in silicon solutions for wireless communications, announce that the companies will form a strategic technology engagement to develop custom solutions for new Open OS enabled 3G devices.
Solutions from the technology created by the two companies will combine small and power efficient 3G modems from Ericsson Mobile Platforms with high-performance OMAP(TM) applications processors from TI. Solutions from the joint engagement will include OMAP, custom basebands and connectivity technologies and will be capable of supporting the major Open OS, which offer easy access to a rich array of applications and services. The result of this joint effort will enable all device manufacturers to offer advanced Open OS handsets for both the high-end and the rapidly growing mid-range market.
The collaboration between Ericsson and TI will enable handset manufacturers to deliver the exciting mobile entertainment and multimedia experiences that consumers around the world are increasingly demanding. Ericsson’s access technology leadership, current HSPA-enabled platforms, and future HSPA evolution and LTE technologies, combined with the cutting-edge multimedia performance enabled by TI’s OMAP 2, OMAP 3 and future generations of OMAP processors, will continue to push the performance boundaries of mobile devices and mobile entertainment features.
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